Temp-Bond - CISMeF

Preferred Label : Temp-Bond;

MeSH note : contains eugenol & zinc oxide;

Registry Number MeSH : 60318-48-1;

Is substance : O;

Origin ID

C076899;

UMLS CUI

C0172722;

MeSH indexing information
- dental restoration, temporary [MeSH Descriptor]
- zinc oxide-eugenol cement [MeSH Descriptor]
MeSH term(s) associated for indexing
- eugenol [MeSH Descriptor]
- zinc oxide [MeSH Descriptor]
Record concept(s)
- Temp-Bond [MeSH concept]
Semantic type(s)
- Biomedical or Dental Material [UMLS semantic type]
- Organic Chemical [UMLS semantic type]