Preferred Label : P50 composite resin;
MeSH note : contains 50% bisGMA and 50% TEGDMA; P50 may also be composed of 12.5% bis GMA and
87.5% ceramic filler (zirconium oxide and silicon dioxide);
MeSH synonym : P-50 composite resin; P-50 hybrid composite; P.50 resin bonded ceramic;
Registry Number MeSH : 117681-35-3;
Is substance : O;
Origin ID : C065771;
UMLS CUI : C0083920;
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