epoxy resin AH-26

Preferred Label : epoxy resin AH-26;

MeSH note : contains powder consisting of silver powder 10%, bismuth oxide 60%, hexamethylenetetramine 25% & titanium dioxide 5% & resin consisting of epoxybisphenol-resin 100%;

MeSH synonym : AH26 sealer; AH-26; AH 26;

Registry Number MeSH : 55599-25-2;

Is substance : O;

Details

Origin ID

C028044;

UMLS CUI

C0051001;

MeSH indexing information
- root canal filling materials [MeSH Descriptor]
MeSH term(s) associated for indexing
- bismuth [MeSH Descriptor]
- epoxy resins [MeSH Descriptor]
- root canal filling materials [MeSH Descriptor]
- silver [MeSH Descriptor]
- titanium [MeSH Descriptor]
Record concept(s)
- epoxy resin AH-26 [MeSH concept]
Semantic type(s)
- Biomedical or Dental Material [UMLS semantic type]
- Chemical Viewed Structurally [UMLS semantic type]

Keyword's position in hierarchy(ies) :

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